Development and Innovation of PCB Technology in Factory

With the rapid development of electronic technology, circuit board manufacturers can only actively develop and innovate production technology on the basis of recognizing the development trend of PCB technology in order to find a way out in the competitive PCB industry.Circuit board manufacturers should always maintain a sense of development, the following are the PCB production and processing technology development points of view:

1. Development of component embedding technology
The component embedding technology is a great change in PCB functional integrated circuits. The PCB “of forming semiconductor devices (called active components), electronic components (called passive components) or passive component functions” embedded components in the inner layer of the PCB has begun to be mass-produced, but the development of circuit board manufacturers must first solve the simulation design method, production technology and inspection quality, reliability assurance is also a top priority. PCB plant must increase the resources investment in the system including design, equipment, testing and simulation to maintain strong vitality.

2.HDI technology remains the mainstream direction
HDI technology promotes the development of mobile phones, the LSI of information processing and control of basic frequency functions and the development of CSP chips (packaging), circuit board packaging template substrate, but also promote the development of PCB, so circuit board manufacturers should follow the HDI road innovation production and processing technology. Since the HDI embodies the most advanced technology of contemporary PCB, it brings fine traverse and micro aperture to the PCB board. Mobile phone (mobile phone) is HDI leading technology model in the application terminal electronics of multilayer board. PCB main board micro wire (50μm~75μm/50μmμm~75 wire width/spacing) has become the mainstream in mobile phone, in addition, conductive layer, plate thickness thin type; conductive graphics micro, bring high density of electronic equipment, high performance.

3.Continuous introduction of advanced production setup, updated circuit board manufacturing process.
HDI manufacturing has matured and tends to be perfect. with the development of PCB technology, although the commonly used subtraction manufacturing methods still dominate in the past, low-cost processes such as addition method and semi-addition method begin to rise. A new technology for making flexible plates by using nano-technology to metallize holes PCB form conductive patterns simultaneously. high reliability, high quality printing method, inkjet PCB process. production of fine conductors, new high resolution photomask and exposure devices and laser direct exposure devices. uniform and uniform coating equipment. Production components embedded (passive active components) manufacturing and installation of equipment and facilities.

4.Developing higher performance PCB raw materials
Whether it is rigid PCB circuit board or flexible PCB circuit board materials, with the global lead-free electronic products, it is necessary to make these materials-resistant, so new high Tg、 thermal expansion coefficient is small, medium constant is small, medium loss angle tangent excellent materials continue to emerge.

5. Optoelectronic PCB prospects
Photoelectric PCB circuit board is the use of optical and circuit layer to transmit signals, this new technology is the key to make optical layer (light waveguide layer). It is an organic polymer, which is formed by lithography, laser ablation, reactive ion etching and so on. At present, the technology has been industrialized in Japan and the United States. As a large country of production, Chinese circuit board manufacturers should also actively respond to the pace of scientific and technological development.


Post time: Sep-23-2020