SMT inspection

AOIs for a PCB board with components may inspect the following features:

  • Area defects
  • Billboarding
  • Component offset
  • Component polarity
  • Component presence or absence
  • Component Skew
  • Excessive Solder Joints
  • Flipped component
  • Height Defects
  • Insufficient Paste around Leads
  • Insufficient Solder Joints
  • Lifted Leads
  • No Population tests
  • Paste Registration
  • Severely Damaged Components
  • Tombstoning
  • Volume Defects
  • Wrong Part
  • Solder Bridging
  • Presence of Foreign Material on the board

AOI can be used in the following locations in the SMT lines: post paste, pre-reflow, post-reflow, or wave areas.


Post time: Sep-24-2020